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6mhz, 750ma mini, adj, stp-dwn dc-dc cnvrtr w/auto bypass for rf pwr amps (rev. b)
LM3242 PRODUCT BRIEF 6MHz, 750mA Miniature, Adjustable, Step-Down DC-DC Converter with Auto Bypass for RF Power Amplifiers LM3242 PRODUCT BRIEF PRODUCT BRIEF 6MHz, 750mA Miniature, Adjustable, Step-Down DC-DC Converter with Auto Bypass for RF Power Amplifiers General Description Features
The LM3242 is a DC-DC converter optimized for powering RF
power amplifiers (PAs) from a single Lithium-Ion cell; howev-
■ Operates from a Single Li-Ion Cell (2.7V to 5.5V)
er, it may be used in many other applications. It steps down
■ Adjustable Output Voltage (0.4V to 3.6V)
an input voltage from 2.7V to 5.5V to an adjustable outputvoltage from 0.4V to 3.6V. Output voltage is set using a VCON
■ 750 mA Maximum Load Capability (up to 1A in Bypass)
analog input for controlling power levels and efficiency of the
■ High Efficiency (95% typ. at 3.9V , 3.3V
The LM3242 offers five modes of operation. In PWM mode
the device operates at a fixed frequency of 6MHz (typ.) at
medium-to-heavy load range and minimizes RF interference.
At light load, the device enters into ECO mode automaticallyand operates with reduced switching frequency. In ECO
mode, the quiescent current is reduced and extends the bat-
■ Small Chip Inductor in 0805 (2012) case size
tery life. Shutdown mode turns the device off and reducesbattery consumption to 0.1 µA (typ.). In low-battery condition,
Applications
Bypass mode reduces the voltage dropout to less than 50 mV(typ.). The part also features a Sleep mode.
■ Battery-Powered 3G/4G RF Power Amplifiers
The LM3242 is available in a 9-bump lead-free micro SMD
package. A high switching frequency (6MHz) allows use of
only three tiny surface-mount components: one inductor and
Notice: This document is not a datasheet. For more in- formation regarding this product or to order samples please contact your local National Semiconductor/Texas Instruments sales office or visit http://focus.ti.com/gen- eral/docs/dsnsuprt.tsp. Typical Application Physical Dimensions inches (millimeters) unless otherwise noted 9-Bump Thin Micro SMD, Large Bump (0.4 mm pitch) NS Package Number TMD09 X1 = 1.35 mm ±0.030 mm X2 = 1.488 mm ±0.030 mm X3 = 0.6 mm ±0.075 mm LM3242 PRODUCT BRIEF TI/NATIONAL INTERIM IMPORTANT NOTICE
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RACHEL'S ENVIRONMENT & HEALTH WEEKLY #630 December 24, 1998 HEADLINES THE NEWS OF 1998, PART 1 E vidence continued to accumulate during 1998 that your diet can drastically alter your chances of getting heart disease and cancer, including breast cancer. The good news is that eating monounsaturated fats (the kind found in olive oil, canola oil, and nuts) seems to have a protective effect a
Jaakko Hyvätti Picprog 1.7 documentationhttp://hyvatti.iki.fi/~jaakko/pic/picprog.htmlJaakko Hyvätti Picprog 1.7 documentationhttp://hyvatti.iki.fi/~jaakko/pic/picprog.htmlhttp://www.iki.fi/hyvatti/pic/picprog.html 2. Requirements Jaakko Hyvätti Picprog 1.7 documentation See the hardware section. This device is connected to a usual serial port of your PC, and is thesame device as used